AMD Ryzen 9000 Zen 5 "Granite Ridge" Desktop Processors Launch Late-July (2024)

AMD's next-generation Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture, is rumored to launch in late-July, 2024, according to multiple sources in the ChipHell tech forums. The first four SKUs in the processor series will include one each of 16-core, 12-core, 8-core, and 6-core, spanning the Ryzen 9, Ryzen 7, and Ryzen 5 series, just like the company's Ryzen 7000 series debut. The company could unveil these processors in its 2024 Computex keynote address early next month, talking about their features and performance in broad strokes, while we get technical previews in the run-up to the late-July launch.

A late-July launch of the Ryzen 9000 series "Granite Ridge" processors should also mean that the various motherboard manufacturers will showcase their upcoming motherboards based on the AMD X870 desktop chipset at Computex. Ryzen 9000 series are built in the existing Socket AM5 package, and should be compatible with existing AMD 600-series chipset motherboards. In fact, most motherboard vendors have already released UEFI firmware updates that include Ryzen 9000 series processor compatibility. Those buying a Ryzen 9000 series processor with an AMD 600-series chipset motherboard can simply take advantage of the USB BIOS Flashback feature that's available on most motherboards, including the entry-level ones.

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AGlezB said:

Let's hope they don't keep the shape of the IHS from the 7000s.
Yes, the 7000s look "cooler" until the moment you try to clean the thermal paste .

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I have not personally experienced the Ryzen 7000 series heat-spreader, but I very much doubt that they will change the external design. The design on the underside may change fractionally if the height of the chiplet(s) or I/O die changes.

If you are concerned about the paste, then the Thermal Grizzly "Kryosheet" might be the solution for you. There is a pretty comprehensive review by Gamers Nexus, it does very well, and can if delicately treated by re-used, it doesn't dry out like thermal paste can and has very good results, right up there with the best thermal pastes, it is relatively expensive, but can be re-used if you swap a heatsink/water cooler, read/watch reviews, it's an interesting and good product and no-doubt other companies will make their own versions and competition will drive the price down.

ADB1979 said:

I have not personally experienced the Ryzen 7000 series heat-spreader, but I very much doubt that they will change the external design. The design on the underside may change fractionally if the height of the chiplet(s) or I/O die changes.

If you are concerned about the paste, then the Thermal Grizzly "Kryosheet" might be the solution for you. There is a pretty comprehensive review by Gamers Nexus, it does very well, and can if delicately treated by re-used, it doesn't dry out like thermal paste can and has very good results, right up there with the best thermal pastes, it is relatively expensive, but can be re-used if you swap a heatsink/water cooler, read/watch reviews, it's an interesting and good product and no-doubt other companies will make their own versions and competition will drive the price down.

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I saw the review and I'd consider Kryosheets if I didn't already have quite a bit of high quality thermal paste lying around.

I don't think I've ever seen another IHS with some many nooks and crannies still don't know why they designed it like that. When I see it and compare to every other x86 IHS ever produced the only thing I can think of is that was an engineer's idea of "cool but functional" and marketing ran with it because it looked "different". And let's not forget that complexity=cost so we paid more for the look of a part that will only ever be visible in store shelves and product brochures.

TL;DR I don't like it and I'll probably skip the 9000s if the IHS is the same.

This is crazy. It was the very start of January 2021 when I got my 5900x which had only launched about 2 months prior. Not even 4 years have passed and it feels like I'm getting so far behind.

I'm excited to see how they turn out. I may not be in the need for one, but I find it exciting to see how far things have progressed in such a short timespan.

AGlezB said:

I saw the review and I'd consider Kryosheets if I didn't already have quite a bit of high quality thermal paste lying around.

I don't think I've ever seen another IHS with some many nooks and crannies still don't know why they designed it like that. When I see it and compare to every other x86 IHS ever produced the only thing I can think of is that was an engineer's idea of "cool but functional" and marketing ran with it because it looked "different". And let's not forget that complexity=cost so we paid more for the look of a part that will only ever be visible in store shelves and product brochures.

TL;DR I don't like it and I'll probably skip the 9000s if the IHS is the same.

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I think it is pretty glaringly obvious with one visual glance at a Ryzen 7xxx CPU, (and even if not, AMD explicitly stated it) that the reason for the design is is simply clearance for surface mount components.
And you think an engineer pushed "cool"? Also it is a mass produced part identical for all AM5 CPUs, under no circ*mstance would they have made a decision to significantly increase production cost of it.

Is THIS really even remotely in your list of factors for deciding a CPU? That you may have to break out a cotton swab?

I am only just now realizing I may be feeding a troll...... oops.

Wasn't it said a generation or two ago that X3D cache will eventually become standard, used on all CPUs? Just not this generation, or that isn't even the plan any more?

I must say it's hard to be excited about CPU release when we'll hear in autumn that MSRP for RTX 5080 is $1799 ($1200 + 50% performance / price uplift as per Jensen's Law)...

Enzarch said:

I think it is pretty glaringly obvious with one visual glance at a Ryzen 7xxx CPU, (and even if not, AMD explicitly stated it) that the reason for the design is is simply clearance for surface mount components.

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AM5 is a new platform. Do you really think the only way to design the CPU was the one that required the IHS to have a complex shape?
I'll believe it the day I see that IHS shape in their workstation/server CPUs.

Enzarch said:

And you think an engineer pushed "cool"?

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You might find this very hard to believe but appearence is a major consideration in product design. In most consumer products, marketing and design are the ones in charge of "cool". In CPU design it's the engineers.

Enzarch said:

Also it is a mass produced part identical for all AM5 CPUs, under no circ*mstance would they have made a decision to significantly increase production cost of it.

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Like I said: complexity equals cost. Compare the IHS between 5000 and 7000 and tell me if both cost the same to manufacture. Without market data is hard to say how significant is the difference is.

And just so you know cost increases as a result of appearence considerations is everywhere because companies hire designers to make their products more attractive. In the vast majority of cases the effect the designer has on the product has absolutely no impact on it's perfomance. The result is we end up paying more for "pretty".

Enzarch said:

Is THIS really even remotely in your list of factors for deciding a CPU? That you may have to break out a cotton swab?

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Everything is in my list of factors. It's the weight of the factors that differs between people.
For me, the less I have to clean the better and that applies to everything, not just computer parts.

Enzarch said:

I am only just now realizing I may be feeding a troll...... oops.

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Thanks! Not very filling and certainly lacking substance but hey, all comments are welcome!
As it happens my favorite food is other trolls. I usually don't bother with the small and feeble ones but don't worry because I can make an exception just for you.

Nordic said:

Hopefully the 9800x3d is not a delayed launch.

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You will be disappointed then. 6 months later, so Q1 2025.

Launcestonian said:

Excellent news, can't wait to see benchmarks & comparisons. Was thinking of an X3D chip with current 7000 series but may as well wait seeing it's only a couple months off now.
Upgrading to an X3D seems more bang for buck worthy than investing in an RDNA 3 card atm. Besides my current RDNA 2 card is an excellent over clocker anyway without saturating it with extra volts.

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If rumours are true, the regular Zen 5 is faster in gaming than Zen 4 X3D. Not sure how believable that is, but I'm expecting Zen 5 to be very strong as it's a large architectural change over Zen 4, just not on the IO. One AMD source once said it's like a Zen 2 -> Zen 3 upgrade in performance. We shall see.

Denver said:

Let's see if the new generation doesn't raise the TDP even higher. I hope not.

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AMD would be smart to release Zen5 at the X3D TDP levels. Everyone has seen how negligible the MT performance loss for 7950X3D vs 7950X is at 80W lower power draw.

Pumper said:

AMD would be smart to release Zen5 at the X3D TDP levels.

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taking for granite AMD wants to try to outdo sales of 7800X3D

AGlezB said:

AM5 is a new platform. Do you really think the only way to design the CPU was the one that required the IHS to have a complex shape?

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Yes, without making the whole CPU larger. It's evident that AMD wanted to keep the heatsink compatibility (as much as possible). Don't ask me why tho.

AGlezB said:

I'll believe it the day I see that IHS shape in their workstation/server CPUs.

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I don't want to get in the way of your beliefs, but EPYC doesn't need that beacuse those get a larger design when needed.

You keep on insisting that it's just to make it look cool, yet AMD fills most of these voids with components? Yeah, I don't see the reasoning behind your conclusion.

AGlezB said:

Let's hope they don't keep the shape of the IHS from the 7000s.
Yes, the 7000s look "cooler" until the moment you try to clean the thermal paste .

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Same socket, same IHS, I'm afraid.

I'm glad you didn't parrot the usual "it runs so hot" bandwagon, and brought up a real issue instead (thermal paste cleaning).

Pumper said:

AMD would be smart to release Zen5 at the X3D TDP levels. Everyone has seen how negligible the MT performance loss for 7950X3D vs 7950X is at 80W lower power draw.

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It's the same when you compare the 7700 to the 7700X, or if you apply your own power/thermal limit in the BIOS.

DeathtoGnomes said:

taking for granite

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AGlezB said:

Let's hope they don't keep the shape of the IHS from the 7000s.
Yes, the 7000s look "cooler" until the moment you try to clean the thermal paste .

Click to expand...

You are right. The IHS weird shape and positioning of the chiplets under it are an instant no-buy reason to me.

Same applies for the intel weird IHS, which resembles women's hygien pads.

ARF said:

You are right. The IHS weird shape and positioning of the chiplets under it are an instant no-buy reason to me.

Same applies for the intel weird IHS, which resembles women's hygien pads.

View attachment 349013View attachment 349014

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You're not wrong there, although, I've never heard of anyone choosing a CPU based on the shape of its IHS.